Resistance to cooking and boiling adhesive

Resistance to cooking and boiling adhesive

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Payment Type:	L/C,T/T
Incoterm:	FOB,CIF,EXW
Min. Order:	1000 Kilogram
Transportation:	Ocean,Land,Air,Express
Port:	Zhongshan,Guangzhou,Shenzhen

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Product Description

Product Attributes

Model No.: XH-60W/K75W

Brand: xinghui

Place Of Origin: China

Classification: Double Components Adhesives

Main Ingredient: Polyurethane

Application Field: Packing

Resin System: polyester polyurethane polyols

Appearance: yellow transparent viscous liquid

Solid Content (%): 60±2

Solvent: ethyl acetate

Viscosity(mPa.s25℃): 1000-3000

Heat Resistance(℃): 135

Coating Amount(g/㎡): 4-6

Curing Temperature(℃): 40-55

Curing Time(h): 72-96

Packaging & Delivery

Selling Units	:	Kilogram
Package Type	:	20kg/barrel
Picture Example	:

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Versatile Polyurethane Adhesive for Multiple Applications

Durable Adhesive for Cooking and Boiling Applications

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Product Description

XH-60W/K75W is a Two Component Solvent Based Polyurethane Adhesive.

It is a kind of Pu Adhesive Glue with high-performance high temperature cooking.

XH-60W Polyurethane Glue is suitable for 135℃ high temperature cooking and disinfection of various plastic films and aluminum foil outer composite structures.

Attention

1. The proportion of main agent and curing agent, users should make appropriate adjustments to the proportion of main agent and curing agent according to the film type, composite structure, printing conditions and climatic conditions (ambient temperature and humidity). In the climate of high temperature and high humidity, users should increase the proportion of curing agent by about 5%~10% on the original basis when compounding the film printed with gravure ink containing a large amount of alcohol diluent and nylon film substrate which is very easy to absorb moisture.

2. After cooking, the peeling strength of some film substrates will decrease, which should be confirmed before use.

3. The production of flexible packaging composite film resistant to high temperature cooking at 135℃ should use film resistant to high temperature cooking at 135℃ and printing ink resistant to high temperature cooking.

4. During the compounding process, attention should be paid to checking and controlling the viscosity of the adhesive, and there should be enough coating and full curing.

5. The packaging bag containing air will swell and rupture after cooking, and its feasibility should be confirmed before use.